| Title |
Mechanical, electrical, and thermal performance of hemp fiber-reinforced elium biocomposites modified with activated carbon nanoparticles: experiment and simulation |
| Authors |
Akhter, Zeenat ; Palevicius, Arvydas ; Fangueiro, Raul ; Ullah, Sultan ; Janusas, Giedrius |
| DOI |
10.3390/polym18010066 |
| Full Text |
|
| Is Part of |
Polymers.. Basel : MDPI. 2026, vol. 18, iss. 1, art. no. 66, p. 1-19.. ISSN 2073-4360 |
| Keywords [eng] |
Elium biocomposites ; FEA ; activated carbon nanoparticles ; electrical conductivity ; hemp fabric ; tensile properties ; thermal stability |
| Abstract [eng] |
This research examines the influence of various concentrations (0%, 1%, 1.4% and 1.8% by weight) of activated carbon nanoparticles (AC NPs) on the performance of Elium biocomposites reinforced with hemp fibers. Unidirectional [0°/0°] laminates with 20% fiber volume fraction were fabricated via hand layup using two layers of 150 GSM hemp fabric and compression molded to achieve 0.9 mm cured thickness. Quasi-static tensile testing (ASTM D3039, 2 mm/min, 100 mm gauge length) revealed a pronounced non-monotonic relationship between AC NPs loading and mechanical properties, with optimal performance at 1.0 wt.% fillers and catastrophic degradation at 1.8 wt.%. AC NPs filled composites, which were then characterized by their electrical and thermal behavior. Electrically, it also achieved minimum resistivity (1.62 Ω·m) and maximum conductivity (0.62 S·m-1), in contrast to the elevated resistance (42.5 kΩ) found in samples with a higher filler content. Thermal analysis showed a slight effect on the degradation of the onset temperature (300 °C) and a higher charring after addition of AC NP. Finite element analysis (FEA) provided a corroboration for these experimental findings, with simulations verification. Microscopy revealed cohesive fractures in the 1.0 wt.% composite whereas voids and brittle failure were evident in samples with higher loading. Hence, the concentration of 1.0 wt.% AC NP offers the best trade off of mechanical, electrical, and thermal properties. |
| Published |
Basel : MDPI |
| Type |
Journal article |
| Language |
English |
| Publication date |
2026 |
| CC license |
|