| Title |
Electrically conductive nanoparticle-enhanced epoxy adhesives for localised joule heating-based curing in composite bonding |
| Authors |
Dragasiute, Karina ; Monastyreckis, Gediminas ; Zeleniakiene, Daiva |
| DOI |
10.3390/polym17091176 |
| Full Text |
|
| Is Part of |
Polymers.. Basel : MDPI. 2025, vol. 17, iss. 9, art. no. 1176, p. 1-21.. ISSN 2073-4360 |
| Keywords [eng] |
adhesives ; carbon nanotube ; curing ; finite element analysis ; shear strength ; thermal imaging analysis |
| Abstract [eng] |
This study investigates the application of carbon nanotube (CNT)-enhanced epoxy adhesives for localised Joule heating-based curing in composite bonding. The electrical, thermal, and mechanical properties of epoxy with 0.25-1 wt% CNT loadings were evaluated. A simple CNT alignment method using DC voltage showed improved electrical conductivity, greatly reducing the percolation threshold. Transient thermal analysis using finite element modelling of representative volume elements revealed that aligned CNTs led to increased localised temperatures near the CNT clusters. The model was validated with infrared thermal imaging analysis, which also showed similar non-linear heat distribution and more uniform heating under higher CNT loading. Additionally, power distribution mapping was evaluated through inverse modelling techniques, suggesting different conductivity zones and cluster distribution within the single-lap joint. The numerical and experimental results demonstrated that CNT alignment significantly enhanced localised conductivity, thereby improving curing efficiency at lower voltages. The lap shear test results showed a peak shear strength of 10.16 MPa at 0.5 wt% CNT loading, 9% higher than pure epoxy. Scanning electron microscopy analysis confirmed the formation of aligned CNT clusters, and how CNT loading affected the failure modes, transitioning from cohesive to void-rich fracture patterns at a higher wt%. These findings establish CNT-enhanced Joule heating as a viable and scalable alternative for efficient composite bonding in aerospace and structural applications. |
| Published |
Basel : MDPI |
| Type |
Journal article |
| Language |
English |
| Publication date |
2025 |
| CC license |
|
