| Title |
Development and investigation of high-temperature ultrasonic measurement transducers resistant to multiple heating–cooling cycles / |
| Authors |
Vaskeliene, Vaida ; Sliteris, Reimondas ; Kazys, Rymantas Jonas ; Zukauskas, Egidijus ; Mazeika, Liudas |
| DOI |
10.3390/s23041866 |
| Full Text |
|
| Is Part of |
Sensors.. Basel : MDPI. 2023, vol. 23, iss. 4, art. no. 1866, p. 1-13.. ISSN 1424-8220 |
| Keywords [eng] |
high-temperature ultrasonic transducer ; PZT ; silver electrode ; copper ; modelling ; heating–cooling cycles |
| Abstract [eng] |
Usually for non-destructive testing at high temperatures, ultrasonic transducers made of PZT and silver electrodes are used, but this could lead to damage to or malfunction of the ultrasonic transducer due to poor adhesion between PZT and silver. Soldering is one of the most common types of bonding used for individual parts of ultrasonic transducers (protector, backing, matching layer, etc.), but silver should be protected using additional metal layers (copper) due to its solubility in solder. A mathematical modelling could help to predict if an ultrasonic transducer was manufactured well and if it could operate up to 225 °C. The observed von Mises stresses were very high and concentrated in metal layers (silver and copper), which could lead to disbonding under long-term cyclic temperature loads. This paper presents a multilayer ultrasonic transducer (PZT, silver electrodes, copper layers, backing), which was heated evenly from room temperature to 225 °C and then cooled down. In the B-scan, it was observed that the amplitude of the reflected signal from the bottom of the sample decreased with an increase in temperature. However, after six heating–cooling cycles, the results repeated themselves and no signs of fatigue were noticed. This ultrasonic transducer was well manufactured and could be used for non-destructive testing when the environment temperature changes in cycles up to 225 °C. |
| Published |
Basel : MDPI |
| Type |
Journal article |
| Language |
English |
| Publication date |
2023 |
| CC license |
|
